Alignment Systems For Subassemblies Of Overmolded Optoeletronic Modules

Patent · Tue Apr 15 00:00:00 EDT 2003

OSTI ID:879650

Chan, Benson ^[1]; Fortier, Paul F ^[2]; Guindon, Francois M ^[3]; Johnson, Glen W ^[4]; Letourneau, Martial A ^[5]; Sherman, John H ^[6]; Tetreault, Real ^[5]

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1. Vestal, NY
2. Richelieu, CA
3. Stukely-Sud, CA
4. Yorktown Heights, NY
5. Granby, CA
6. Lisle, NY

Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

• Assignee: International Business Machines Corporation (Armonk, NY)
• Patent Number(s): US 6547452
• Application Number: 09/568978
• OSTI ID: 879650
• Country of Publication: United States
• Language: English