Method For Making Electronic Circuits Having Nial And Ni3al Substrates
Patent
·
OSTI ID:879577
- Midlothian, VA
- Oak Ridge, TN
A method for making electronic circuit component having improved mechanical properties and thermal conductivity comprises steps of providing NiAl and/or Ni.sub.3 Al, and forming an alumina layer thereupon prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.
- Research Organization:
- Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
- DOE Contract Number:
- AC05-84OR21400
- Assignee:
- UT-Battelle, LLC (Oak Ridge, TN)
- Patent Number(s):
- US 6,179,953
- Application Number:
- 09/260124
- OSTI ID:
- 879577
- Country of Publication:
- United States
- Language:
- English
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