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Title: Electronic circuits having NiAl and Ni.sub.3 Al substrates

Abstract

An electronic circuit component having improved mechanical properties and thermal conductivity comprises NiAl and/or Ni.sub.3 Al, upon which an alumina layer is formed prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.

Inventors:
 [1];  [2]
  1. (Midlothian, VA)
  2. (Oak Ridge, TN)
Publication Date:
Research Org.:
LOCKHEED MARTIN ENRGY SYST INC
OSTI Identifier:
872577
Patent Number(s):
US 5965274
Assignee:
Lockheed Martin Energy Research Corporation (Oak Ridge, TN) ORNL
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
electronic; circuits; nial; substrates; circuit; component; improved; mechanical; properties; thermal; conductivity; comprises; alumina; layer; formed; prior; applying; conductive; elements; additional; layers; copper-aluminum; alloy; copper; improve; strength; circuit component; additional layers; electronic circuit; improved mechanical; thermal conductivity; mechanical properties; mechanical strength; aluminum alloy; alumina layer; electronic circuits; conductive elements; improve mechanical; formed prior; additional layer; conductivity comprises; /428/

Citation Formats

Deevi, Seetharama C., and Sikka, Vinod K. Electronic circuits having NiAl and Ni.sub.3 Al substrates. United States: N. p., 1999. Web.
Deevi, Seetharama C., & Sikka, Vinod K. Electronic circuits having NiAl and Ni.sub.3 Al substrates. United States.
Deevi, Seetharama C., and Sikka, Vinod K. Fri . "Electronic circuits having NiAl and Ni.sub.3 Al substrates". United States. https://www.osti.gov/servlets/purl/872577.
@article{osti_872577,
title = {Electronic circuits having NiAl and Ni.sub.3 Al substrates},
author = {Deevi, Seetharama C. and Sikka, Vinod K.},
abstractNote = {An electronic circuit component having improved mechanical properties and thermal conductivity comprises NiAl and/or Ni.sub.3 Al, upon which an alumina layer is formed prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {1}
}

Patent:

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