Double sided circuit board and a method for its manufacture

Patent · Sun Jan 01 00:00:00 EST 1989

OSTI ID:875236

Lindenmeyer, Carl W. ^[1]

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1. St. Charles, IL

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.

• Research Organization: Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC02-76CH03000
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): H000650
• Application Number: 07/182671
• OSTI ID: 875236
• Resource Relation: Patent File Date: 1988 Apr 14
• Country of Publication: United States
• Language: English

Related Subjects

statutory invention registration
double
sided
circuit
board
method
manufacture
conductance
printed
provided
eliminates
chemical
immersion
photographic
exposure
entire
plurality
through-holes
drilled
punched
substratum
according
desired
pattern
conductive
laminae
adhere
covering
holes
pressed
permanently
joined
providing
paths
circuit board
printed circuit
conductive path
desired pattern
conductive paths
double sided
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