Double sided circuit board and a method for its manufacture
Patent
·
OSTI ID:1176602
Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.
- Research Organization:
- Fermi National Accelerator Laboratory (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC02-76CH03000
- Assignee:
- The United States of America as represented by the United States Department of Energy (Washington, DC)
- Patent Number(s):
- H000650
- Application Number:
- 07/182671
- OSTI ID:
- 1176602
- Country of Publication:
- United States
- Language:
- English
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