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Monolithic integration of a MOSFET with a MEMS device

Patent ·
OSTI ID:875099
 [1];  [2]
  1. Albuquerque, NM
  2. Albuquerque, MN
+ Show Author Affiliations
An integrated microelectromechanical system comprises at least one MOSFET interconnected to at least one MEMS device on a common substrate. A method for integrating the MOSFET with the MEMS device comprises fabricating the MOSFET and MEMS device monolithically on the common substrate. Conveniently, the gate insulator, gate electrode, and electrical contacts for the gate, source, and drain can be formed simultaneously with the MEMS device structure, thereby eliminating many process steps and materials. In particular, the gate electrode and electrical contacts of the MOSFET and the structural layers of the MEMS device can be doped polysilicon. Dopant diffusion from the electrical contacts is used to form the source and drain regions of the MOSFET. The thermal diffusion step for forming the source and drain of the MOSFET can comprise one or more of the thermal anneal steps to relieve stress in the structural layers of the MEMS device.
Research Organization:
SANDIA CORP
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 6531331
OSTI ID:
875099
Country of Publication:
United States
Language:
English

References (8)

Embedded micromechanical devices for the monolithic integration of MEMS and CMOS report July 1995
An integration process of micro electro mechanical polysilicon with CMOS analog/digital circuits journal December 1999
Laminated, sacrificial-poly MEMS technology in standard CMOS journal August 2000
A fabrication process for integrating polysilicon microstructures with post-processed CMOS circuits journal June 2000
A monolithic fully-integrated vacuum-sealed CMOS pressure sensor journal January 2002
Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments conference January 1997
Integration of sputtered silicon microstructures with pre-fabricated CMOS circuitry journal July 2001
CMOS-based microsensors and packaging journal August 2001

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