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Cantilevered multilevel LIGA devices and methods

Patent ·
OSTI ID:874775
 [1];  [2]
  1. Pleasanton, CA
  2. Danville, CA
+ Show Author Affiliations

In the formation of multilevel LIGA microstructures, a preformed sheet of photoresist material, such as polymethylmethacrylate (PMMA) is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the exposed photoresist material. A first microstructure is then formed by electroplating metal into the areas from which the photoresist has been removed. Additional levels of microstructure are added to the initial microstructure by covering the first microstructure with a conductive polymer, machining the conductive polymer layer to reveal the surface of the first microstructure, sealing the conductive polymer and surface of the first microstructure with a metal layer, and then forming the second level of structure on top of the first level structure. In such a manner, multiple layers of microstructure can be built up to allow complex cantilevered microstructures to be formed.

Research Organization:
SANDIA CORP
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia National Laboratories (Livermore, CA)
Patent Number(s):
US 6458263
OSTI ID:
874775
Country of Publication:
United States
Language:
English

References (4)

Various replication techniques for manufacturing three-dimensional metal microstructures journal December 1997
Molding of three dimensional microstructures by the LIGA process conference January 1992
Molding of LIGA microstructures from fluorinated polymers journal October 1996
Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process) journal May 1986

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