Micromechanical die attachment surcharge

Patent · Mon Dec 31 23:00:00 EST 2001

OSTI ID:874449

Filter, William F ^[1]; Hohimer, John P ^[1]

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1. Albuquerque, NM

An attachment structure is disclosed for attaching a die to a supporting substrate without the use of adhesives or solder. The attachment structure, which can be formed by micromachining, functions purely mechanically in utilizing a plurality of shaped pillars (e.g. round, square or polygonal and solid, hollow or slotted) that are formed on one of the die or supporting substrate and which can be urged into contact with various types of mating structures including other pillars, a deformable layer or a plurality of receptacles that are formed on the other of the die or supporting substrate, thereby forming a friction bond that holds the die to the supporting substrate. The attachment structure can further include an alignment structure for precise positioning of the die and supporting substrate to facilitate mounting the die to the supporting substrate. The attachment structure has applications for mounting semiconductor die containing a microelectromechanical (MEM) device, a microsensor or an integrated circuit (IC), and can be used to form a multichip module. The attachment structure is particularly useful for mounting die containing released MEM devices since these devices are fragile and can otherwise be damaged or degraded by adhesive or solder mounting.

• Research Organization: SANDIA CORP
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corporation (Albuquerque, NM)
• Patent Number(s): US 6392144
• OSTI ID: 874449
• Country of Publication: United States
• Language: English

Related Subjects

/174/
adhesive
adhesives
alignment
applications
attaching
attachment
bond
circuit
contact
containing
damaged
deformable
degraded
device
devices
die
disclosed
facilitate
form
formed
forming
fragile
friction
functions
holds
hollow
including
integrated
integrated circuit
layer
mating
mechanically
microelectromechanical
micromachining
micromechanical
microsensor
module
mounting
multichip
otherwise
pillars
plurality
polygonal
positioning
precise
purely
receptacles
released
semiconductor
shaped
slotted
solder
solid
square
structure
structures
substrate
supporting
supporting substrate
surcharge
types
urged
useful
utilizing
various types