Substrate system for spray forming

Patent · Tue Jan 01 00:00:00 EST 2002

OSTI ID:874420

Chu, Men G ^[1]; Chernicoff, William P ^[2]

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1. Export, PA
2. Harrisburg, PA

A substrate system for receiving a deposit of sprayed metal droplets including a movable outer substrate on which the sprayed metal droplets are deposited. The substrate system also includes an inner substrate disposed adjacent the outer substrate where the sprayed metal droplets are deposited on the outer substrate. The inner substrate includes zones of differing thermal conductivity to resist substrate layer porosity and to resist formation of large grains and coarse constituent particles in a bulk layer of the metal droplets which have accumulated on the outer substrate. A spray forming apparatus and associated method of spray forming a molten metal to form a metal product using the substrate system of the invention is also provided.

• Research Organization: Aluminum Company of America (Pittsburgh, PA)
• DOE Contract Number: FC07-94ID13238
• Assignee: Alcoa Inc. (Pittsburgh, PA)
• Patent Number(s): US 6386266
• OSTI ID: 874420
• Country of Publication: United States
• Language: English

Related Subjects

substrate
spray
forming
receiving
deposit
sprayed
metal
droplets
including
movable
outer
deposited
inner
disposed
adjacent
zones
differing
thermal
conductivity
resist
layer
porosity
formation
grains
coarse
constituent
particles
bulk
accumulated
apparatus
associated
method
molten
form
product
provided
molten metal
thermal conductivity
metal product
spray forming
substrate disposed
metal droplet
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