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Title: Substrate system for spray forming

Abstract

A substrate system for receiving a deposit of sprayed metal droplets including a movable outer substrate on which the sprayed metal droplets are deposited. The substrate system also includes an inner substrate disposed adjacent the outer substrate where the sprayed metal droplets are deposited on the outer substrate. The inner substrate includes zones of differing thermal conductivity to resist substrate layer porosity and to resist formation of large grains and coarse constituent particles in a bulk layer of the metal droplets which have accumulated on the outer substrate. A spray forming apparatus and associated method of spray forming a molten metal to form a metal product using the substrate system of the invention is also provided.

Inventors:
 [1];  [2]
  1. (Export, PA)
  2. (Harrisburg, PA)
Publication Date:
Research Org.:
Aluminum Company of America (Pittsburgh, PA)
OSTI Identifier:
873327
Patent Number(s):
US 6135198
Assignee:
Aluminum Company of America (Pittsburgh, PA) IDO
DOE Contract Number:  
FC07-94ID13238
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
substrate; spray; forming; receiving; deposit; sprayed; metal; droplets; including; movable; outer; deposited; inner; disposed; adjacent; zones; differing; thermal; conductivity; resist; layer; porosity; formation; grains; coarse; constituent; particles; bulk; accumulated; apparatus; associated; method; molten; form; product; provided; substrate layer; associated method; forming apparatus; substrate disposed; metal droplets; disposed adjacent; thermal conductivity; molten metal; spray forming; metal product; sprayed metal; metal droplet; /164/

Citation Formats

Chu, Men G., and Chernicoff, William P. Substrate system for spray forming. United States: N. p., 2000. Web.
Chu, Men G., & Chernicoff, William P. Substrate system for spray forming. United States.
Chu, Men G., and Chernicoff, William P. Sat . "Substrate system for spray forming". United States. https://www.osti.gov/servlets/purl/873327.
@article{osti_873327,
title = {Substrate system for spray forming},
author = {Chu, Men G. and Chernicoff, William P.},
abstractNote = {A substrate system for receiving a deposit of sprayed metal droplets including a movable outer substrate on which the sprayed metal droplets are deposited. The substrate system also includes an inner substrate disposed adjacent the outer substrate where the sprayed metal droplets are deposited on the outer substrate. The inner substrate includes zones of differing thermal conductivity to resist substrate layer porosity and to resist formation of large grains and coarse constituent particles in a bulk layer of the metal droplets which have accumulated on the outer substrate. A spray forming apparatus and associated method of spray forming a molten metal to form a metal product using the substrate system of the invention is also provided.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sat Jan 01 00:00:00 EST 2000},
month = {Sat Jan 01 00:00:00 EST 2000}
}

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