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Method for making surfactant-templated, high-porosity thin films

Patent ·
OSTI ID:873911
 [1];  [2];  [1]
  1. Albuquerque, NM
  2. San Jose, CA
+ Show Author Affiliations

An evaporation-induced self-assembly method to prepare a surfactant-templated thin film by mixing a silica sol, a surfactant, and a hydrophobic polymer and then evaporating a portion of the solvent during coating onto a substrate and then heating to form a liquid-phase, thin film material with a porosity greater than approximately 50 percent. The high porosity thin films can have dielectric constants less than 2 to be suitable for applications requiring low-dielectric constants. An interstitial compound can be added to the mixture, with the interstitial compound either covalently bonded to the pores or physically entrapped within the porous structure. The selection of the interstitial compound provides a means for developing thin films for applications including membranes, sensors, low dielectric constant films, photonic materials and optical hosts.

Research Organization:
SANDIA CORP
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 6270846
OSTI ID:
873911
Country of Publication:
United States
Language:
English

References (5)

Functionalized Monolayers on Ordered Mesoporous Supports journal May 1997
Synthesis and Characterization of a Reactive Vinyl-Functionalized MCM-41:  Probing the Internal Pore Structure by a Bromination Reaction journal April 1997
Continuous self-assembly of organic–inorganic nanocomposite coatings that mimic nacre journal July 1998
Synthesis and characterization of ordered organo–silica–surfactant mesophases with functionalized MCM-41-type architecture journal January 1997
Synthesis of hybrid inorganic–organic mesoporous silica by co-condensation of siloxane and organosiloxane precursors journal January 1996

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Related Subjects

/427/
50
added
applications
applications including
applications requiring
approximately
bonded
coating
compound
constant
constants
covalently
covalently bonded
developing
dielectric
dielectric constant
dielectric constants
entrapped
evaporating
evaporation-induced
film
film material
films
form
heating
high-porosity
hosts
hydrophobic
hydrophobic polymer
including
including membrane
interstitial
liquid-phase
low-dielectric
material
materials
means
membranes
method
mixing
mixture
optical
percent
photonic
physically
polymer
pores
porosity
porous
porous structure
portion
prepare
provides
requiring
selection
self-assembly
sensors
silica
silica sol
sol
solvent
structure
substrate
suitable
surfactant
surfactant-templated