Method of physical vapor deposition of metal oxides on semiconductors
Patent
·
OSTI ID:873663
- Knoxville, TN
A process for growing a metal oxide thin film upon a semiconductor surface with a physical vapor deposition technique in a high-vacuum environment and a structure formed with the process involves the steps of heating the semiconductor surface and introducing hydrogen gas into the high-vacuum environment to develop conditions at the semiconductor surface which are favorable for growing the desired metal oxide upon the semiconductor surface yet is unfavorable for the formation of any native oxides upon the semiconductor. More specifically, the temperature of the semiconductor surface and the ratio of hydrogen partial pressure to water pressure within the vacuum environment are high enough to render the formation of native oxides on the semiconductor surface thermodynamically unstable yet are not so high that the formation of the desired metal oxide on the semiconductor surface is thermodynamically unstable. Having established these conditions, constituent atoms of the metal oxide to be deposited upon the semiconductor surface are directed toward the surface of the semiconductor by a physical vapor deposition technique so that the atoms come to rest upon the semiconductor surface as a thin film of metal oxide with no native oxide at the semiconductor surface/thin film interface. An example of a structure formed by this method includes an epitaxial thin film of (001)-oriented CeO.sub.2 overlying a substrate of (001) Ge.
- Research Organization:
- LOCKHEED MARTIN ENERGY RES COR
- DOE Contract Number:
- AC05-96OR22464
- Assignee:
- UT-Battelle, LLC (Oak Ridge, TN)
- Patent Number(s):
- US 6214712
- OSTI ID:
- 873663
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
-oriented
/438/117/148/427/
001
atoms
ceo
conditions
constituent
deposited
deposition
deposition technique
desired
desired metal
directed
environment
epitaxial
established
example
favorable
film
formation
formed
gas
growing
heating
high-vacuum
hydrogen
hydrogen gas
hydrogen partial
interface
introducing
involves
metal
metal oxide
metal oxides
method
native
overlying
oxide
oxides
partial
partial pressure
physical
physical vapor
pressure
process
process involves
ratio
render
semiconductor
semiconductor surface
semiconductors
specifically
steps
structure
structure formed
substrate
surface
technique
temperature
thermodynamically
thermodynamically unstable
unfavorable
unstable
vacuum
vacuum environment
vapor
vapor deposition
water
water pressure
/438/117/148/427/
001
atoms
ceo
conditions
constituent
deposited
deposition
deposition technique
desired
desired metal
directed
environment
epitaxial
established
example
favorable
film
formation
formed
gas
growing
heating
high-vacuum
hydrogen
hydrogen gas
hydrogen partial
interface
introducing
involves
metal
metal oxide
metal oxides
method
native
overlying
oxide
oxides
partial
partial pressure
physical
physical vapor
pressure
process
process involves
ratio
render
semiconductor
semiconductor surface
semiconductors
specifically
steps
structure
structure formed
substrate
surface
technique
temperature
thermodynamically
thermodynamically unstable
unfavorable
unstable
vacuum
vacuum environment
vapor
vapor deposition
water
water pressure