Method and apparatus for component separation using microwave energy

Patent · Tue Apr 03 04:00:00 EDT 2001

OSTI ID:873647

Morrow, Marvin S ^[1]; Schechter, Donald E ^[2]

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1. Kingston, TN
2. Ten Mile, TN

A method for separating and recovering components includes the steps of providing at least a first component bonded to a second component by a microwave absorbent adhesive bonding material at a bonding area to form an assembly, the bonding material disposed between the components. Microwave energy is directly and selectively applied to the assembly so that substantially only the bonding material absorbs the microwave energy until the bonding material is at a debonding state. A separation force is applied while the bonding material is at the debonding state to permit disengaging and recovering the components. In addition, an apparatus for practicing the method includes holders for the components.

• Research Organization: LOCKHEED MARTIN ENRGY SYST INC
• DOE Contract Number: AC05-84OR21400
• Assignee: BWXT Y-12 L.L.C. (Oak Ridge, TN)
• Patent Number(s): US 6211499
• Application Number: 09/306356
• OSTI ID: 873647
• Country of Publication: United States
• Language: English

Related Subjects

/219/134/
absorbent
absorbs
addition
adhesive
adhesive bond
adhesive bonding
apparatus
applied
assembly
bonded
bonding
bonding material
component
components
debonding
directly
disengaging
disposed
energy
force
form
holders
material
material disposed
method
microwave
microwave energy
permit
practicing
providing
recovering
selectively
separating
separation
steps
substantially
wave energy