Adhesive bonding using variable frequency microwave energy
Patent
·
OSTI ID:672712
Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy. 26 figs.
- Research Organization:
- Lockheed Martin Energy Syst Inc
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC05-84OR21400
- Assignee:
- Lambda Technologies Inc., Raleigh, NC (United States); Lockheed Martin Energy Research Corp., Oak Ridge, TN (United States)
- Patent Number(s):
- US 5,798,395/A/
- Application Number:
- PAN: 8-626,207
- OSTI ID:
- 672712
- Country of Publication:
- United States
- Language:
- English
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