Adhesive bonding using variable frequency microwave energy

Patent · Thu Jan 01 04:00:00 EST 1998

OSTI ID:871798

Lauf, Robert J ^[1]; McMillan, April D ^[2]; Paulauskas, Felix L ^[1]; Fathi, Zakaryae ^[3]; Wei, Jianghua ^[4]

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1. Oak Ridge, TN
2. Knoxville, TN
3. Cary, NC
4. Raleigh, NC

Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy.

• Research Organization: LOCKHEED MARTIN ENRGY SYST INC
• DOE Contract Number: AC05-84OR21400
• Assignee: Lambda Technologies Inc. (Raleigh, NC); Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
• Patent Number(s): US 5798395
• OSTI ID: 871798
• Country of Publication: United States
• Language: English

Related Subjects

/522/156/204/219/
adhesive
adhesive bond
adhesive bonding
apparatus
article
articles
bonded
bonding
cavity
components
conductive
conductive fibers
cure
decreased
disclosed
disposed
disposed therein
edge
edge portion
energy
enter
facilitating
fibers
fibers therein
frequencies
frequency
frequency microwave
heating
heating apparatus
irradiated
methods
microwave
microwave energy
microwave heating
microwaves
multimode
oriented
placing
polymeric
polymeric adhesive
portion
provided
required
selectively
shielded
therein
time
time required
uniformly
uniformly heat
variable
variable frequency
various
various component
various components
varying
via
wave energy