Method for manufacturing compound semiconductor field-effect transistors with improved DC and high frequency performance
Patent
·
OSTI ID:873071
- Vienna, VA
- Rockville, MD
- Albuquerque, NM
A method for making compound semiconductor devices including the use of a p-type dopant is disclosed wherein the dopant is co-implanted with an n-type donor species at the time the n-channel is formed and a single anneal at moderate temperature is then performed. Also disclosed are devices manufactured using the method. In the preferred embodiment n-MESFETs and other similar field effect transistor devices are manufactured using C ions co-implanted with Si atoms in GaAs to form an n-channel. C exhibits a unique characteristic in the context of the invention in that it exhibits a low activation efficiency (typically, 50% or less) as a p-type dopant, and consequently, it acts to sharpen the Si n-channel by compensating Si donors in the region of the Si-channel tail, but does not contribute substantially to the acceptor concentration in the buried p region. As a result, the invention provides for improved field effect semiconductor and related devices with enhancement of both DC and high-frequency performance.
- Research Organization:
- SANDIA CORP
- DOE Contract Number:
- AC04-94AL85000;
- Assignee:
- United States of America as represented by United States (Washington, DC)
- Patent Number(s):
- US 6083781
- OSTI ID:
- 873071
- Country of Publication:
- United States
- Language:
- English
The use of multi-species implantation for carrier profile control in GaAs MESFETs fabricated using silicon ion implantation
|
book | January 1993 |
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Related Subjects
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50
acceptor
activation
anneal
atoms
buried
characteristic
co-implanted
compensating
compound
compound semiconductor
concentration
consequently
context
contribute
dc
devices
devices including
disclosed
donor
donor species
donors
dopant
effect
effect transistor
effect transistors
efficiency
embodiment
enhancement
exhibits
field
field effect
field-effect
field-effect transistor
field-effect transistors
form
formed
frequency
gaas
high-frequency
improved
improved field
including
manufactured
manufacturing
method
moderate
moderate temperature
n-channel
n-mesfets
n-type
p-type
p-type dopant
performance
performed
preferred
preferred embodiment
provides
rate temperature
region
related
result
semiconductor
semiconductor device
semiconductor devices
semiconductor field
sharpen
si-channel
similar
similar field
single
species
substantially
tail
temperature
time
transistor
transistors
type dopant
typically
unique
unique characteristic
50
acceptor
activation
anneal
atoms
buried
characteristic
co-implanted
compensating
compound
compound semiconductor
concentration
consequently
context
contribute
dc
devices
devices including
disclosed
donor
donor species
donors
dopant
effect
effect transistor
effect transistors
efficiency
embodiment
enhancement
exhibits
field
field effect
field-effect
field-effect transistor
field-effect transistors
form
formed
frequency
gaas
high-frequency
improved
improved field
including
manufactured
manufacturing
method
moderate
moderate temperature
n-channel
n-mesfets
n-type
p-type
p-type dopant
performance
performed
preferred
preferred embodiment
provides
rate temperature
region
related
result
semiconductor
semiconductor device
semiconductor devices
semiconductor field
sharpen
si-channel
similar
similar field
single
species
substantially
tail
temperature
time
transistor
transistors
type dopant
typically
unique
unique characteristic