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Method for making high-critical-current-density YBa.sub.2 Cu.sub.3 O.sub.7 superconducting layers on metallic substrates

Patent ·
OSTI ID:872610
A method is disclosed for fabricating YBa.sub.2 Cu.sub.3 O.sub.7 superconductor layers with the capability of carrying large superconducting currents on a metallic tape (substrate) supplied with a biaxially textured oxide buffer layer. The method represents a simplification of previously established techniques and provides processing requirements compatible with scale-up to long wire (tape) lengths and high processing speeds. This simplification has been realized by employing the BaF.sub.2 method to grow a YBa.sub.2 Cu.sub.3 O.sub.7 film on a metallic substrate having a biaxially textured oxide buffer layer.
Research Organization:
Oak Ridge National Laboratory (ORNL), Oak Ridge, TN
DOE Contract Number:
AC05-96OR22464
Assignee:
Lockheed Martin Energy (Oak Ridge, TN)
Patent Number(s):
US 5972847
OSTI ID:
872610
Country of Publication:
United States
Language:
English

References (3)

Reproducible technique for fabrication of thin films of high transition temperature superconductors journal November 1987
Deposition of biaxially-oriented metal and oxide buffer-layer films on textured Ni tapes: new substrates for high-current, high-temperature superconductors journal February 1997
Orientation of YBa 2 Cu 3 O 7− x films on unbuffered and CeO 2 ‐buffered yttria‐stabilized zirconia substrates journal October 1994