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Multi-layer carbon-based coatings for field emission

Patent ·
OSTI ID:871903

A multi-layer resistive carbon film field emitter device for cold cathode field emission applications. The multi-layered film of the present invention consists of at least two layers of a conductive carbon material, preferably amorphous-tetrahedrally coordinated carbon, where the resistivities of adjacent layers differ. For electron emission from the surface, the preferred structure can be a top layer having a lower resistivity than the bottom layer. For edge emitting structures, the preferred structure of the film can be a plurality of carbon layers, where adjacent layers have different resistivities. Through selection of deposition conditions, including the energy of the depositing carbon species, the presence or absence of certain elements such as H, N, inert gases or boron, carbon layers having desired resistivities can be produced.

Research Organization:
SANDIA CORP
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 5821680
OSTI ID:
871903
Country of Publication:
United States
Language:
English

References (6)

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Electron emission from chemical vapor deposited diamond and dielectric breakdown journal August 1994
Synthesis of n-type semiconducting diamond film using diphosphorus pentaoxide as the doping source journal October 1990
Diamond‐like carbon films prepared with a laser ion source journal July 1988
Bipolar transistor action in ion implanted diamond journal November 1982
Growth of Device-Quality Homoepitaxial Diamond Thin Films journal January 1989