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U.S. Department of Energy
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Heat pipe with embedded wick structure

Patent ·
OSTI ID:871638

A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.

Research Organization:
SANDIA CORP
DOE Contract Number:
AC04-94AL85000
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 5769154
OSTI ID:
871638
Country of Publication:
United States
Language:
English

References (2)

The LIGA technique-what are the new opportunities journal September 1992
Deep and fast plasma etching for silicon micromachining journal January 1995