Heat pipe with embedded wick structure

Patent · 23 June 1998

OSTI ID:672604

Adkins, D R; Shen, D S; Tuck, M R; Palmer, D W; Grafe, V G

A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas. 7 figs.

• Research Organization: Sandia Corporation
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corp., Albuquerque, NM (United States)
• Patent Number(s): US 5,769,154/A/
• Application Number: PAN: 8-593,596
• OSTI ID: 672604
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
CAPILLARY FLOW
HEAT PIPE WICKS
HEAT PIPES
HEAT TRANSFER
HEAT TRANSFER FLUIDS
INTEGRATED CIRCUITS