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Tin-silver-bismuth solders for electronics assembly

Patent ·
OSTI ID:870014
 [1];  [1]
  1. Albuquerque, NM
+ Show Author Affiliations

A lead-free solder alloy for electronic assemblies composed of a eutectic alloy of tin and silver with a bismuth addition, x, of 0

Research Organization:
AT & T CORP
DOE Contract Number:
AC04-76DP00789
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 5439639
OSTI ID:
870014
Country of Publication:
United States
Language:
English

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Related Subjects

/420/148/
10
205
218
33ag-4
83bi
84sn-3
91
added
addition
alloy
alloy composition
amount
analysis
assemblies
assembly
based
bismuth
composed
composition
degree
depending
depress
desired
desired level
determined
dsc
effective
electronic
electronics
eutectic
eutectic alloy
lead-free
lead-free solder
level
melting
percent
percent based
preferred
preferred alloy
ranges
silver
silver alloy
solder
solder alloy
solders
tin-silver
tin-silver-bismuth
total
weight
weight based
weight percent