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High temperature superconductor step-edge Josephson junctions using Ti-Ca-Ba-Cu-O

Patent ·
OSTI ID:869576
A process for formulating non-hysteretic and hysteretic Josephson junctions using HTS materials which results in junctions having the ability to operate at high temperatures while maintaining high uniformity and quality. The non-hysteretic Josephson junction is formed by step-etching a LaAlO.sub.3 crystal substrate and then depositing a thin film of TlCaBaCuO on the substrate, covering the step, and forming a grain boundary at the step and a subsequent Josephson junction. Once the non-hysteretic junction is formed the next step to form the hysteretic Josephson junction is to add capacitance to the system. In the current embodiment, this is accomplished by adding a thin dielectric layer, LaA1O.sub.3, followed by a cap layer of a normal metal where the cap layer is formed by first depositing a thin layer of titanium (Ti) followed by a layer of gold (Au). The dielectric layer and the normal metal cap are patterned to the desired geometry.
Research Organization:
AT & T CORP
DOE Contract Number:
AC04-76DP00789
Assignee:
Sandia Corporation (Albuquerque, NM)
Patent Number(s):
US 5358928
Application Number:
07/949,098
OSTI ID:
869576
Country of Publication:
United States
Language:
English

References (14)

Tl‐Ca‐Ba‐Cu‐O step‐edge Josephson junctions journal March 1992
Principles of Superconductive Devices and Circuits journal February 1982
Ideal tunneling characteristics in Ba 1− x K x BiO 3 point‐contact junctions with Au and Nb tips journal November 1990
Orientation Dependence of Grain-Boundary Critical Currents in Y Ba 2 Cu 3 O 7 − δ Bicrystals journal July 1988
Quantum limited quasiparticle mixers at 100 GHz journal March 1991
High-speed Josephson processor technology journal March 1991
Fabrication of TlCaBaCuO step‐edge Josephson junctions with hysteretic behavior journal February 1992
Practical high T c Josephson junctions and dc SQUIDs operating above 85 K journal June 1991
Fabrication of Tunnel Junction Structures book January 1989
Fabrication of Tl‐Ca‐Ba‐Cu‐O superconducting thin films on LaAlO 3 substrates journal April 1990
Morphology control and high critical currents in superconducting thin films in the Tl-Ca-Ba-Cu-O system journal August 1989
High-T/sub c/ thin-film magnetometer journal March 1991
Bi‐epitaxial grain boundary junctions in YBa 2 Cu 3 O 7 journal August 1991
Substrate step‐edge YBa 2 Cu 3 O 7 rf SQUIDs journal February 1991