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Title: High temperature superconductor step-edge Josephson junctions using Ti-Ca-Ba-Cu-O

Patent ·
OSTI ID:6846815

A process is disclosed for formulating non-hysteretic and hysteretic Josephson junctions using HTS materials which results in junctions having the ability to operate at high temperatures while maintaining high uniformity and quality. The non-hysteretic Josephson junction is formed by step-etching a LaAlO[sub 3] crystal substrate and then depositing a thin film of TlCaBaCuO on the substrate, covering the step, and forming a grain boundary at the step and a subsequent Josephson junction. Once the non-hysteretic junction is formed the next step to form the hysteretic Josephson junction is to add capacitance to the system. In the current embodiment, this is accomplished by adding a thin dielectric layer, LaA1O[sub 3], followed by a cap layer of a normal metal where the cap layer is formed by first depositing a thin layer of titanium (Ti) followed by a layer of gold (Au). The dielectric layer and the normal metal cap are patterned to the desired geometry. 8 figs.

DOE Contract Number:
AC04-76DP00789
Assignee:
Sandia Corp., Albuquerque, NM (United States)
Patent Number(s):
US 5358928; A
Application Number:
PPN: US 7-949098
OSTI ID:
6846815
Resource Relation:
Patent File Date: 22 Sep 1992
Country of Publication:
United States
Language:
English