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Title: Superconducting microcircuitry by the microlithgraphic patterning of superconducting compounds and related materials

Patent ·
OSTI ID:868896

Superconducting microcircuits including a thin layer of Ba.sub.2 Cu.sub.3 O.sub.5+x (0<1) on a substrate. A thin layer of a dopant; for example, Y.sub.2 O.sub.3 for superconducting patterns of YBa.sub.2 Cu.sub.3 O.sub.7-x, or Pr.sub.2 O.sub.3 for insulator patterns of PrBa.sub.2 Cu.sub.3 O.sub.7-x. These layers are covered with a layer of photoresist, which is exposed to light through a mask having a pattern for a desired circuit. The photoresist is then developed to reveal a pattern of the thin dopant layer which will be etched away. The microcircuit is then etched and stripped to remove the unneeded portion of the thin dopant layer. Finally, the microcircuit is heated at a temperature and for a period of time sufficient to diffuse and react the dopant layer with the thin layer of Ba.sub.2 Cu.sub.3 O.sub.5+x, forming a pattern of superconductor or insulator.

Research Organization:
Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
DOE Contract Number:
W-7405-ENG-36
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Number(s):
US 5238913
OSTI ID:
868896
Country of Publication:
United States
Language:
English