Di-p-xylylene polymer and method for making the same

Patent · 01 January 1985

OSTI ID:865352

Jahn, Randy K ^[1]; Liepins, Raimond ^[1]

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1. Los Alamos, NM

A method and apparatus for forming an improved poly-p-xylylene film. Solid di-para-xylylene dimer is sublimed in a sublimation furnace at approximately 100.degree. to 200.degree. C. and subsequently conducted to a pyrolysis furnace where it is pyrolyzed to the diradical p-xylylene monomer while in the vapor state at approximately 600 degrees C. The diradical monomer is then introduced into a deposition chamber for deposition onto a suitable substrate. The deposition chamber includes electrodes for producing a low pressure plasma through which the diradical monomer passes prior to deposition. The interaction of the diradical monomer with the low pressure plasma results in the formation of poly-p-xylylene film which is exceptionally hard and thermally stable.

• Research Organization: Los Alamos National Laboratory (LANL), Los Alamos, NM
• DOE Contract Number: W-7405-ENG-36
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 4500562
• OSTI ID: 865352
• Country of Publication: United States
• Language: English

Related Subjects

/427/204/528/
100
200
600
apparatus
approximately
chamber
conducted
degree
degrees
deposition
deposition chamber
di-p-xylylene
di-para-xylylene
dimer
diradical
electrodes
exceptionally
film
formation
forming
furnace
hard
improved
interaction
introduced
method
monomer
p-xylylene
passes
plasma
poly-p-xylylene
polymer
pressure
pressure plasma
prior
producing
pyrolysis
pyrolyzed
results
solid
stable
sublimation
sublimed
subsequently
substrate
suitable
suitable substrate
thermally
thermally stable
vapor