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Di-p-xylylene polymer and method for making the same

Patent ·
OSTI ID:865352

A method and apparatus for forming an improved poly-p-xylylene film. Solid di-para-xylylene dimer is sublimed in a sublimation furnace at approximately 100.degree. to 200.degree. C. and subsequently conducted to a pyrolysis furnace where it is pyrolyzed to the diradical p-xylylene monomer while in the vapor state at approximately 600 degrees C. The diradical monomer is then introduced into a deposition chamber for deposition onto a suitable substrate. The deposition chamber includes electrodes for producing a low pressure plasma through which the diradical monomer passes prior to deposition. The interaction of the diradical monomer with the low pressure plasma results in the formation of poly-p-xylylene film which is exceptionally hard and thermally stable.

Research Organization:
Los Alamos National Laboratory (LANL), Los Alamos, NM
DOE Contract Number:
W-7405-ENG-36
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Number(s):
US 4500562
OSTI ID:
865352
Country of Publication:
United States
Language:
English