DI-P-xylylene polymer and method for making the same

Patent · Tue Feb 19 04:00:00 EST 1985

OSTI ID:5559794

Jahn, R K; Liepins, R

A method and apparatus for forming an improved poly-p-xylylene film. Solid di-para-xylylene dimer is sublimed in a sublimation furnace at approximately 100/sup 0/ to 200/sup 0/ C. and subsequently conducted to a pyrolysis furnace where it is pyrolyzed to the diradical p-xylylene monomer while in the vapor state at approximately 600 degrees C. The diradical monomer is then introduced into a deposition chamber for deposition onto a suitable substrate. The deposition chamber includes electrodes for producing a low pressure plasma through which the diradical monomer passes prior to deposition. The interaction of the diradical monomer with the low pressure plasma results in the formation of poly-p-xylylene film which is exceptionally hard and thermally stable.

• Assignee: The United States of America as represented by the United States Department of Energy
• Patent Number(s): US 4500562
• OSTI ID: 5559794
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420300* -- Engineering-- Lasers-- (-1989)
ALKYLATED AROMATICS
AROMATICS
CHEMICAL REACTIONS
COATINGS
DECOMPOSITION
DEPOSITION
DIMERS
FILMS
HYDROCARBONS
LASER TARGETS
MONOMERS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
POLYMERS
PRODUCTION
PROTECTIVE COATINGS
PYROLYSIS
SURFACE COATING
TARGETS
THERMOCHEMICAL PROCESSES
VACUUM COATING
XYLENE-PARA
XYLENES