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Viscoelastic Stress Relaxation in Film/Substrate Systems -- Kelvin Model

Journal Article · · Journal of Applied Physics
DOI:https://doi.org/10.1063/1.1541108· OSTI ID:829453
 [1]
  1. ORNL
+ Show Author Affiliations
No abstract prepared.
Research Organization:
ORNL Oak Ridge National Laboratory
Sponsoring Organization:
DOE
DOE Contract Number:
AC05-00OR22725
OSTI ID:
829453
Report Number(s):
P02-114605
Journal Information:
Journal of Applied Physics, Journal Name: Journal of Applied Physics Journal Issue: 5 Vol. 93; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English

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Related Subjects

36 MATERIALS SCIENCE
ELASTICITY
FILMS
MATHEMATICAL MODELS
STRESS RELAXATION
SUBSTRATES
VISCOSITY