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Reflectance-Correcting Pyrometry in Thin Film Deposition Applications

Technical Report ·
DOI:https://doi.org/10.2172/820889· OSTI ID:820889

A detailed study of an emissivity-correcting pyrometer instrument for measuring wafer surface temperatures during thin film growth is presented. The basic physics is reviewed and preliminary data showing a temperature over-compensation artifact is shown. The rest of the report presents an exhaustive analysis of the potential sources for the temperature over-compensation effect. This analysis yields an in situ calibration method that can be used to remove temperature over-compensation artifacts that arise from any first-order systematic error in either the reflectance or thermal emission measurement. With corrections applied, artifact-free surface temperatures can be measured with a precision of a few {sup o}C over a wide range of wafer emissivities.

Research Organization:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
820889
Report Number(s):
SAND2003-1868
Country of Publication:
United States
Language:
English

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