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Mesoscale X-ray diffraction measurement of stress relaxation associated with buckling in compressed thin films

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.1591081· OSTI ID:815420

Compressed thin films deposited on substrates may buckle depending on the geometrical and mechanical properties of the film/substrate set. Until recently, the small dimensions of the buckling have prevented measurements of their local in plane internal stress distribution. Using a Scanning X-ray Micro diffraction (mSXRD) technique developed at a 3rd generation x-ray synchrotron source, we obtained thin film internal stress maps for circular blisters and telephone chord buckling with micrometric spatial resolution. A fair agreement was found between the film delamination topology observed by optical microscopy and the measured stress maps. We evidenced residual stress relaxation associated with the film buckling: the top is essentially stress-free while adherent region exhibits large compressive stresses.

Research Organization:
Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (US)
Sponsoring Organization:
USDOE Director, Office of Science. Basic Energy Sciences (US)
DOE Contract Number:
AC03-76SF00098
OSTI ID:
815420
Report Number(s):
LBNL--53307
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 1 Vol. 83; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English