Electromigration-induced plastic deformation in passivated metal lines
- LBNL Library
We have used scanning white beam x-ray microdiffraction to study microstructural evolution during an in-situ electromigration experiment on a passivated Al(Cu) test line. The data show plastic deformation and grain rotations occurring under the influence of electromigration, seen as broadening, movement, and splitting of reflections diffracted from individual metal grains. We believe this deformation is due to localized shear stresses that arise due to the inhomogeneous transfer of metal along the line. Deviatoric stress measurements show changes in the components of stress within the line, including relaxation of stress when current is removed.
- Research Organization:
- Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (US)
- Sponsoring Organization:
- USDOE Director, Office of Science. Office of Basic Energy Studies (US)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 807433
- Report Number(s):
- LBNL--51753; B& R KC0204016
- Journal Information:
- Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 22 Vol. 81; ISSN APPLAB; ISSN 0003-6951
- Country of Publication:
- United States
- Language:
- English
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