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Electromigration-induced plastic deformation in passivated metal lines

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.1525880· OSTI ID:807433
We have used scanning white beam x-ray microdiffraction to study microstructural evolution during an in-situ electromigration experiment on a passivated Al(Cu) test line. The data show plastic deformation and grain rotations occurring under the influence of electromigration, seen as broadening, movement, and splitting of reflections diffracted from individual metal grains. We believe this deformation is due to localized shear stresses that arise due to the inhomogeneous transfer of metal along the line. Deviatoric stress measurements show changes in the components of stress within the line, including relaxation of stress when current is removed.
Research Organization:
Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (US)
Sponsoring Organization:
USDOE Director, Office of Science. Office of Basic Energy Studies (US)
DOE Contract Number:
AC03-76SF00098
OSTI ID:
807433
Report Number(s):
LBNL--51753; B& R KC0204016
Journal Information:
Applied Physics Letters, Journal Name: Applied Physics Letters Journal Issue: 22 Vol. 81; ISSN APPLAB; ISSN 0003-6951
Country of Publication:
United States
Language:
English

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