Electromigration-Induced Plastic Deformation in Passivated Metal Lines
- SLAC
We have used scanning white beam x-ray microdiffraction to study microstructural evolution during an in-situ electromigration experiment on a passivated Al(Cu) test line. The data show plastic deformation and grain rotations occurring under the influence of electromigration, seen as broadening, movement, and splitting of reflections diffracted from individual metal grains. We believe this deformation is due to localized shear stresses that arise due to the inhomogeneous transfer and deposition of metal along the line. Deviatoric stress measurements show changes in the components of stress within the line, including relaxation of stress when current is removed.
- Research Organization:
- Stanford Linear Accelerator Center, Menlo Park, CA (US)
- Sponsoring Organization:
- USDOE Office of Energy Research (ER) (US)
- DOE Contract Number:
- AC03-76SF00515
- OSTI ID:
- 799100
- Report Number(s):
- SLAC-PUB-9259
- Country of Publication:
- United States
- Language:
- English
Similar Records
Electromigration-induced plastic deformation in passivated metal lines
Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt percentCu) interconnect
Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt percent Cu) interconnect
Journal Article
·
Tue Nov 19 23:00:00 EST 2002
· Applied Physics Letters
·
OSTI ID:807433
Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt percentCu) interconnect
Journal Article
·
Mon Jul 19 00:00:00 EDT 2004
· Microelectronic Engineering
·
OSTI ID:838553
Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt percent Cu) interconnect
Journal Article
·
Mon Jul 19 00:00:00 EDT 2004
· Microelectronic Engineering
·
OSTI ID:838584