Wetting and interface integrity of Sn-Ag-Bi solder/Fe-42 percent Ni alloy system
Journal Article
·
· Transactions of the Japan Welding Research Institute
OSTI ID:795976
- LBNL Library
The wetting and interfacial integrity of lead-free Sn-Ag and Sn-Ag-Bi solders with 42 alloy (Fe-42wt percent Ni) were investigated. A tin-iron intermetallic layer formed at the interface and, during cooling, Ni3Sn4 platelets precipitated in the solder. After bonding, the Sn-3Ag joints have a eutectic microstructure, with a fine network of Ag3Sn particles surrounding large primary -Sn grains. Bismuth addition to Sn-3Ag improved wettability, but decreased the joint strength, owing to Bi segregation to the interface.
- Research Organization:
- Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (US)
- Sponsoring Organization:
- USDOE Director, Office of Science (US)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 795976
- Report Number(s):
- LBNL--49861
- Journal Information:
- Transactions of the Japan Welding Research Institute, Journal Name: Transactions of the Japan Welding Research Institute Vol. 30
- Country of Publication:
- United States
- Language:
- English
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