Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Anderson, Iver E.; Harringa, Joel L.; Boesenberg, Adam J.

Pb-free Sn—Ag—Cu—Al or Sn—Cu—Al solder

Patent · Tue Oct 15 04:00:00 EDT 2019

OSTI ID:1600142

Anderson, Iver E.; Harringa, Joel L.; Boesenberg, Adam J.

A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.

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Research Organization:: Ames Laboratory (AMES), Ames, IA (United States)

Sponsoring Organization:: USDOE

DOE Contract Number:: AC02-07CH11358

Assignee:: Iowa State University Research Foundation, Inc. (Ames, IA)

Patent Number(s):: 10,442,037

Application Number:: 14/544,833

OSTI ID:: 1600142

Country of Publication:: United States

Language:: English

References (20)

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability Anderson, I. E.; Foley, J. C.; Cook, B. A. Journal of Electronic Materials, Vol. 30, Issue 9 https://doi.org/10.1007/s11664-001-0129-5	journal	September 2001
The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints Liu, Weiping; Lee, Ning-Cheng JOM, Vol. 59, Issue 7 https://doi.org/10.1007/s11837-007-0085-5	journal	July 2007
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu Kang, Sung K.; Shih, Da-Yuan; Donald, Ny. JOM, Vol. 55, Issue 6 https://doi.org/10.1007/s11837-003-0143-6	journal	June 2003
Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties Song, Jenn-Ming; Lin, Jian-Jhih; Huang, Chi-Feng Materials Science and Engineering: A, Vol. 466, Issue 1-2 https://doi.org/10.1016/j.msea.2007.04.121	journal	September 2007
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Suppression of void coalescence in thermal aging of tin-silver-copper-X solder joints Anderson, I. E.; Harringa, J. L. Journal of Electronic Materials, Vol. 35, Issue 1 https://doi.org/10.1007/s11664-006-0190-1	journal	January 2006
The Effect of Small Additives on the Undercooling of Pure Tin [溶融錫の過冷におよぼす微量添加元素の影響] Ohno, Atsumi; Motegi, Tetsuichi Journal of the Japan Institute of Metals, Vol. 37, Issue 7 https://doi.org/10.2320/jinstmet1952.37.7_777	journal	January 1973
Alloying modification of Sn–Ag–Cu solders by manganese and titanium Lin, Li-Wei; Song, Jenn-Ming; Lai, Yi-Shao Microelectronics Reliability, Vol. 49, Issue 3 https://doi.org/10.1016/j.microrel.2008.10.001	journal	March 2009
Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects De Monlevade, Eduardo Franco; Peng, Weiqun Journal of Electronic Materials, Vol. 36, Issue 7 https://doi.org/10.1007/s11664-006-0062-8	journal	June 2007
Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications Kang, S. K.; Lauro, P.; Shih, D. -Y. IBM Journal of Research and Development, Vol. 49, Issue 4.5 https://doi.org/10.1147/rd.494.0607	journal	July 2005
Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications Anderson, Iver E. Journal of Materials Science: Materials in Electronics, Vol. 18, Issue 1-3 https://doi.org/10.1007/s10854-006-9011-9	journal	September 2006
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The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints Swenson, D. Journal of Materials Science: Materials in Electronics, Vol. 18, Issue 1-3 https://doi.org/10.1007/s10854-006-9012-8	journal	September 2006
Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design Anderson, Iver E.; Walleser, Jason W.; Harringa, Joel L. Journal of Electronic Materials, Vol. 38, Issue 12 https://doi.org/10.1007/s11664-009-0936-7	journal	September 2009
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Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints Anderson, I. E.; Walleser, J.; Harringa, J. L. JOM, Vol. 59, Issue 7 https://doi.org/10.1007/s11837-007-0087-3	journal	July 2007
Physics and materials challenges for lead-free solders Tu, K. N.; Gusak, A. M.; Li, M. Journal of Applied Physics, Vol. 93, Issue 3 https://doi.org/10.1063/1.1517165	journal	February 2003

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