Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability
Journal Article
·
· Journal of Electronic Materials
No abstract prepared.
- Research Organization:
- Ames Lab., Ames, IA (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- W-7405-Eng-82
- OSTI ID:
- 792000
- Report Number(s):
- IS-J 6702; JECMA5; TRN: US0601946
- Journal Information:
- Journal of Electronic Materials, Vol. 30, Issue 9; ISSN 0361-5235
- Country of Publication:
- United States
- Language:
- English
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