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Title: Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability

Abstract

No abstract prepared.

Authors:
; ; ; ; ;
Publication Date:
Research Org.:
Ames Laboratory (AMES), Ames, IA
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
792000
Report Number(s):
IS-J 6702
Journal ID: ISSN 0361-5235; JECMA5; TRN: US0601946
DOE Contract Number:  
W-7405-Eng-82
Resource Type:
Journal Article
Journal Name:
Journal of Electronic Materials
Additional Journal Information:
Journal Volume: 30; Journal Issue: 9; Journal ID: ISSN 0361-5235
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; ALLOYS; METALLURGICAL EFFECTS; STABILITY

Citation Formats

Anderson, I E, Foley, J C, Cook, B A, Harringa, J, Terpstra, R L, and Unal, O. Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability. United States: N. p., 2001. Web. doi:10.1007/s11664-001-0129-5.
Anderson, I E, Foley, J C, Cook, B A, Harringa, J, Terpstra, R L, & Unal, O. Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability. United States. doi:10.1007/s11664-001-0129-5.
Anderson, I E, Foley, J C, Cook, B A, Harringa, J, Terpstra, R L, and Unal, O. Thu . "Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability". United States. doi:10.1007/s11664-001-0129-5.
@article{osti_792000,
title = {Alloying Effects in Near-Eutectic Sn-Ag-Cu Solder Alloys for Improved Microstructural Stability},
author = {Anderson, I E and Foley, J C and Cook, B A and Harringa, J and Terpstra, R L and Unal, O},
abstractNote = {No abstract prepared.},
doi = {10.1007/s11664-001-0129-5},
journal = {Journal of Electronic Materials},
issn = {0361-5235},
number = 9,
volume = 30,
place = {United States},
year = {2001},
month = {5}
}