Observations of microstructural coarsening in micro flip-chip solder joints
Journal Article
·
· Journal of Electronic Materials
Coarsening of solder microstructures dramatically affects fatigue lifetimes. This paper presents a study of microstructural evolution due to thermal cycling and aging of small solder joints.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Director, Office of Science (US)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 789170
- Report Number(s):
- LBNL-48851; JECMA5; R&D Project: 511201; TRN: AH200137%%371
- Journal Information:
- Journal of Electronic Materials, Vol. 30, Issue 9; Other Information: Journal Publication Date: Sept. 2001; PBD: 6 Mar 2001; ISSN 0361-5235
- Country of Publication:
- United States
- Language:
- English
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