Microstructural Coarsening during Thermomechanical Fatigue and Annealing of Micro Flip-Chip Solder Joints
- Univ. of California, Berkeley, CA (United States)
Microstructural evolution due to thermal effects was studied in micro solder joints (55 ± 5 μm). The composition of the Sn/Pb solder studied was found to be hypereutectic with a tin content of 65-70 wt%.This was determined by Energy Dispersive X-ray analysis and confirmed with quantitative stereology. The quantitative stereological value of the surface-to-volume ratio was used to characterize and compare the coarsening during thermal cycling from 0-160 C to the coarsening during annealing at 160 C. The initial coarsening of the annealed samples was more rapid than the cycled samples, but tapered off as time to the one-half as expected. Because the substrates to which the solder was bonded have different thermal expansion coefficients, the cycled samples experienced a mechanical strain with thermal cycling. The low-strain cycled samples had a 2.8% strain imposed on the solder and failed by 1,000 cycles, despite undergoing less coarsening than the annealed samples. The high-strain cycled samples experienced a 28% strain and failed between 25 and 250 cycles. No failures were observed in the annealed samples. Failure mechanisms and processing issues unique to small, fine pitch joints are also discussed.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 760289
- Report Number(s):
- LBNL-42633; TRN: AH200032%%97
- Resource Relation:
- Other Information: TH: Thesis (M.S.); Submitted to the University of California, Berkeley; Department of Materials Science and Mineral Engineering; PBD: 1 Dec 1998
- Country of Publication:
- United States
- Language:
- English
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