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Development of a high density pixel multichip module at Fermilab

Conference ·
OSTI ID:775508

At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The BTeV pixel detector is based on a design relying on a hybrid approach. With this approach, the readout chip and the sensor array are developed separately and the detector is constructed by flip-chip mating the two together. This method offers maximum flexibility in the development process, choice of fabrication technologies, and the choice of sensor material. This paper presents strategies to handle the required data rate and performance results of the first prototype and detector hybridization.

Research Organization:
Fermi National Accelerator Lab., Batavia, IL (US)
Sponsoring Organization:
USDOE Office of Energy Research (ER) (US)
DOE Contract Number:
AC02-76CH03000
OSTI ID:
775508
Report Number(s):
FERMILAB-Conf-01/016-E
Country of Publication:
United States
Language:
English

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