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FPIX2: A radiation-hard pixel readout chip for BTeV

Conference ·
OSTI ID:769147

A radiation-hard pixel readout chip, FPIX2, is being developed at Fermilab for the recently approved BTeV experiment. Although designed for BTeV, this chip should also be appropriate for use by CDF and DZero. A short review of this development effort is presented. Particular attention is given to the circuit redesign which was made necessary by the decision to implement FPIX2 using a standard deep-submicron CMOS process rather than an explicitly radiation-hard CMOS technology, as originally planned. The results of initial tests of prototype 0.25{micro} CMOS devices are presented, as are plans for the balance of the development effort.

Research Organization:
Fermi National Accelerator Lab., Batavia, IL (US)
Sponsoring Organization:
USDOE Office of Energy Research (ER) (US)
DOE Contract Number:
AC02-76CH03000
OSTI ID:
769147
Report Number(s):
FERMILAB-Conf-00/316-E
Country of Publication:
United States
Language:
English

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