Hall-Petch hardening in pulsed laser deposited nickel and copper thin films

Conference · Mon Jan 03 00:00:00 EST 2000

OSTI ID:750201

Knapp, J A; Follstaedt, D M; Banks, J C; Myers, Jr, S M

Very fine-grained Ni and Cu films were formed using pulsed laser deposition on fused silica substrates. The grain sizes in the films were characterized by electron microscopy, and the mechanical properties were determined by ultra-low load indentation, with finite-element modeling used to separate the properties of the layers from those of the substrate. Some Ni films were also examined after annealing to 350 and 450 C to enlarge the grain sizes. These preliminary results show that the observed hardnesses are consistent with a simple extension of the Hall-Petch relationship to grain sizes as small as 11 nm for Ni and 32 nm for Cu.

• Research Organization: Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
• Sponsoring Organization: US Department of Energy (US)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 750201
• Report Number(s): SAND99-1563C; TRN: AH200007%%70
• Resource Relation: Conference: MRS 1999 Fall Meeting, Boston, MA, 12/14/1999--12/19/1999; Other Information: PBD: 3 Jan 2000
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
NICKEL
COPPER
THIN FILMS
GRAIN SIZE
HARDNESS
MECHANICAL TESTS
ELECTRON MICROSCOPY