Nanoindentation study of the mechanical properties of copper-nickel multilayered thin films

Journal Article · Mon May 07 00:00:00 EDT 1990 · Applied Physics Letters; (USA)

DOI:https://doi.org/10.1063/1.103070· OSTI ID:6816198

Cammarata, R C; Schlesinger, T E ^[1]; Kim, C; Qadri, S B; Edelstein, A S ^[2]

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1. Department of Materials Science and Engineering, The Johns Hopkins University, Baltimore, Maryland 21218 (USA)
2. Naval Research Laboratory, 4555 Overlook Avenue, Washington, D.C. 20375 (USA)

The mechanical properties of multilayered Cu-Ni thin films with bilayer thicknesses of 1.6--12 nm were investigated by a nanoindentation technique. Force-displacement curves generated during loading and unloading of a diamond tip indenter were used to determine the hardness and elastic properties of the films. No enhancement in the elastic properties (supermodulus effect) was seen, but an enhancement in the hardness was observed. It is suggested that the enhancement, which displayed a Hall--Petch-type behavior, can be understood as owing to dislocation pinning at the interfaces analogous to the mechanism of grain boundary hardening.

• DOE Contract Number: AC05-76OR00033
• OSTI ID: 6816198
• Journal Information: Applied Physics Letters; (USA), Journal Name: Applied Physics Letters; (USA) Vol. 56:19; ISSN APPLA; ISSN 0003-6951
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360103* -- Metals & Alloys-- Mechanical Properties
COPPER
ELASTICITY
ELEMENTS
HARDNESS
MECHANICAL PROPERTIES
METALS
NICKEL
TENSILE PROPERTIES
TRANSITION ELEMENTS
YOUNG MODULUS