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Critical epitaxial thicknesses for low-temperature (20--100 [degree]C) Ge(001)2[times]1 growth by molecular-beam epitaxy

Journal Article · · Journal of Applied Physics; (United States)
DOI:https://doi.org/10.1063/1.354691· OSTI ID:7368868
; ; ; ;  [1]
  1. Materials Research Laboratory, Coordinated Science Laboratory, and Department of Materials Science, University of Illinois, 1101 West Springfield Avenue, Urbana, Illinois 61801 (United States)
The growth of Ge(001) by molecular-beam epitaxy at temperatures [ital T][sub [ital s]] between 20 and 100 [degree]C, and deposition rates of 0.5 and 1 A s[sup [minus]1], was investigated using a combination of [ital in] [ital situ] reflection high-energy electron diffraction and post-deposition cross-sectional transmission electron microscopy. All films consisted of three zones beginning with a defect-free epitaxial layer of thickness [ital t][sub 1] in which ln([ital t][sub 1])[proportional to](1/[ital T][sub [ital s]]). The second zone was a narrower intermediate layer containing [l brace]111[r brace] stacking faults and microtwins, while the third zone was amorphous. An atomistic growth model is proposed to explain the observed morphological breakdown during low-temperature growth.
DOE Contract Number:
FG02-91ER45439
OSTI ID:
7368868
Journal Information:
Journal of Applied Physics; (United States), Journal Name: Journal of Applied Physics; (United States) Vol. 74:4; ISSN JAPIAU; ISSN 0021-8979
Country of Publication:
United States
Language:
English