Semiconductor laser device and a method for fabricating the same
A semiconductor laser device is described that is comprised of the following: an n-type GaAs layer, an n-type GaAlAs layer disposed on the n-type GaAs layer, an optical confinement region comprising a laser active region consisting of GaAs disposed on the n-type GaAlAs layer, a first p-type GaAlAs region whose aluminum content is less than that of the n-type GaAlAs layer, disposed on said laser active region and a second p-type GaAlAs region whose aluminum content is less than that of the first p-type GaAlAs region, the surface of which opposite that disposed on said first p-type GaAlAs region is a periodically corrugated surface, a p-type GaAlAs layer whose aluminum content is more than that of said first p-type GaAlAs region, disposed on the periodically corrugated surface of the second p-type GaAlAs region, a p-type GaAs layer disposed on said p-type GaAlAs layer, and electrodes disposed on the n-type and p-type GaAs layers, respectively, and which has a very low threshold value for laser oscillation and which is fabricated with a very high yield rate.
- Assignee:
- Hitachi, Ltd.
- Patent Number(s):
- US 4025939
- OSTI ID:
- 7312536
- Resource Relation:
- Patent Priority Date: Priority date 11 Jun 1975, Japan
- Country of Publication:
- United States
- Language:
- English
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