Predictive thermal and mechanical modeling of a developmental MCM

Journal Article · Wed Jul 01 00:00:00 EDT 1992 · JOM (Journal of the Minerals, Metals and Materials Society); (United States)

OSTI ID:7304898

Turlik, I ^[1]; Darveaux, R ^[2]; Murty, K L ^[3]

---

1. MCNC, Research Triangle Park, NC (US)
2. Motorola, Ft. Lauderdale, FL (US)
3. North Carolina State Univ., NC (US)

Under development at the Microelectronics Center of North Carolina is a high-performance multichip module (MCM) that utilizes 95Pb-5Sn and indium solders. In this article, a rigorous thermal/mechanical analysis is applied to the module, with specific emphasis on the solder joint reliability. The methodology includes mechanical characterization of solder joints, thermal modeling, linear structural modeling, nonlinear thermal stress simulations, and fatigue-like prediction as a function of chip power dissipation. The results of the analysis provide insight toward design optimization and fatigue life acceleration factors that relate laboratory tests to field use conditions.

• OSTI ID: 7304898
• Journal Information: JOM (Journal of the Minerals, Metals and Materials Society); (United States), Journal Name: JOM (Journal of the Minerals, Metals and Materials Society); (United States) Vol. 44:7; ISSN JOMME
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360603 -- Materials-- Properties
360606 -- Other Materials-- Physical Properties-- (1992-)
42 ENGINEERING
426000* -- Engineering-- Components
Electron Devices & Circuits-- (1990-)
99 GENERAL AND MISCELLANEOUS
990200 -- Mathematics & Computers
DESIGN
DEVELOPED COUNTRIES
ELECTRONIC CIRCUITS
FATIGUE
JOINTS
LIFETIME
MECHANICAL PROPERTIES
MICROELECTRONIC CIRCUITS
MICROELECTRONICS
NONLINEAR PROBLEMS
NORTH AMERICA
NORTH CAROLINA
OPTIMIZATION
PERFORMANCE TESTING
PHYSICAL PROPERTIES
RELIABILITY
SERVICE LIFE
SOLDERED JOINTS
STRESSES
TESTING
THERMAL STRESSES
THERMODYNAMIC PROPERTIES
USA