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Temperature stability of Al/sub x/Ga/sub 1/. sqrt. /sub x/As (0less than or equal toxless than or equal to1) thermal oxide masks for selective-area epitaxy

Journal Article · · J. Appl. Phys.; (United States)
DOI:https://doi.org/10.1063/1.341894· OSTI ID:7257010

The use of thermal oxides of Al/sub x/Ga/sub 1/..sqrt../sub x/As (0less than or equal toxless than or equal to1) as masking materials for selective-area epitaxy by organometallic chemical-vapor deposition has been investigated. It was found that the thermal oxide of GaAs is only applicable for low growth temperatures (less than or equal to600 /sup 0/C), and the addition of aluminum significantly improves the thermal stability of the oxide. The oxide of Al/sub 0.4/Ga/sub 0.6/As is suitable for high-temperature deposition, but there are criteria for the thickness and oxidation temperature. Thin layers of AlAs oxidized at 475 /sup 0/C are excellent masks and allow precise thickness control. Promising results of selective-area deposition using these aluminum oxide masks have been obtained. High-quality single crystal grew in mask openings uniformly surrounded by dense and fine-grain polycrystalline deposits, producing a planar duplication of the original pattern.

Research Organization:
Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, Massachusetts 01003
OSTI ID:
7257010
Journal Information:
J. Appl. Phys.; (United States), Journal Name: J. Appl. Phys.; (United States) Vol. 64:2; ISSN JAPIA
Country of Publication:
United States
Language:
English