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Title: Method of inducing differential etch rates in glow discharge produced amorphous silicon

Patent ·
OSTI ID:7256520

A method of inducing differential etch rates in glow discharge produced amorphous silicon by heating a portion of the glow discharge produced amorphous silicon to a temperature of about 365 C higher than the deposition temperature prior to etching is disclosed. The etch rate of the exposed amorphous silicon is less than the unheated amorphous silicon. 1 fig.

Assignee:
RCA Corp., New York, NY (United States)
Patent Number(s):
US 4217393; A
Application Number:
PPN: US 5-927627
OSTI ID:
7256520
Resource Relation:
Patent File Date: 24 Jul 1978
Country of Publication:
United States
Language:
English