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Brittle fracture of Cu-30 Au induced by a surface layer

Journal Article · · Journal of the Electrochemical Society; (United States)
DOI:https://doi.org/10.1149/1.2069496· OSTI ID:7238120
;  [1];  [2]
  1. California Univ., Berkeley, CA (United States)
  2. Lawrence Berkeley Lab., CA (United States)
A dealloyed surface layer formed on Cu-30 Au with zero applied stress by anodic polarization in 0.6 M NaCl was found to be capable of inducing intergranular fracture of the normally ductile substrate during impact loading. If the sample was simultaneously stressed and dealloyed, the fracture mode was transgranular cleavage. This paper reports that the results indicate that the mechanisms of intergranular stress corrosion cracking and transgranular stress corrosion cracking of Cu-30 Au are identical.
DOE Contract Number:
AC03-76SF00098
OSTI ID:
7238120
Journal Information:
Journal of the Electrochemical Society; (United States), Journal Name: Journal of the Electrochemical Society; (United States) Vol. 139:6; ISSN JESOA; ISSN 0013-4651
Country of Publication:
United States
Language:
English