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Trapped-hole annealing and electron trapping in metal-oxide-semiconductor devices

Journal Article · · Applied Physics Letters; (United States)
DOI:https://doi.org/10.1063/1.107126· OSTI ID:7237690
; ;  [1]
  1. Sandia National Laboratories, Department 1332, Albuquerque, New Mexico 87185-5800 (United States)
Thermally stimulated current- and capacitance-voltage techniques are combined to provide the first quantitative estimates of the contributions of trapped-hole annealing and electron trapping to oxide-trap charge neutralization in metal-oxide-semiconductor devices. For 350-nm nonradiation-hardened oxides, trapped electrons compensate {similar to}15% of the radiation-induced trapped positive charge after x-ray irradiation (evidently forming dipolar defects), and {similar to}65% of the trapped positive charge remaining after positive-bias annealing at 80 {degree}C. For 45-nm radiation-hardened oxides, trapped electrons compensate {similar to}45% of the trapped positive charge after irradiation, and {similar to}70% after annealing. Implications for models of oxide-trap-charge buildup and annealing are discussed.
DOE Contract Number:
AC04-76DP00789
OSTI ID:
7237690
Journal Information:
Applied Physics Letters; (United States), Journal Name: Applied Physics Letters; (United States) Vol. 60:16; ISSN APPLA; ISSN 0003-6951
Country of Publication:
United States
Language:
English