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U.S. Department of Energy
Office of Scientific and Technical Information

Low density microcellular foams

Patent ·
OSTI ID:7237657
This patent describes a low density epoxy foam material prepared by a process. It comprises selecting a multifunctional epoxy oligomer resin; mixing the epoxy resin with a non-reactive organic diluent to form a resin-diluent mixture; forming a diluent containing cross linked epoxy gel from the resin diluent mixture; replacing the diluent with a solvent therefor; replacing the solvent with liquid carbon dioxide; and vaporizing off the liquid carbon dioxide under super critical condition, whereby a foam having a density of less than about 50 mg/cm{sup 3} and cell diameters less than about 1 {mu}m is produced.
Assignee:
Dept. of Energy, Washington, DC (United States)
Patent Number(s):
US 5116883; A
Application Number:
PPN: US 7-701722
OSTI ID:
7237657
Country of Publication:
United States
Language:
English