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Title: Low density microcellular foams

Patent ·
OSTI ID:7085424

Disclosed is a process of producing microcellular foam which comprises the steps of: (a) selecting a multifunctional epoxy oligomer resin; (b) mixing said epoxy resin with a non-reactive diluent to form a resin-diluent mixture; (c) forming a diluent containing cross-linked epoxy gel from said resin-diluent mixture; (d) replacing said diluent with a solvent therefore; (e) replacing said solvent with liquid carbon dioxide; and (f) vaporizing off said liquid carbon dioxide under supercritical conditions, whereby a foam having a density in the range of 35-150 mg/cc and cell diameters less than about 1 [mu]m is produced. Also disclosed are the foams produced by the process. 8 figures.

DOE Contract Number:
W-7405-ENG-48
Assignee:
Dept. of Energy, Washington, DC (United States)
Patent Number(s):
US 5066684; A
Application Number:
PPN: US 7-535007
OSTI ID:
7085424
Resource Relation:
Patent File Date: 8 Jun 1990
Country of Publication:
United States
Language:
English