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Temperature dependent properties of potting materials. Final report

Technical Report ·
DOI:https://doi.org/10.2172/7218817· OSTI ID:7218817
The physical properties: mechanical, electrical, and thermal of a general purpose epoxy potting compound, filled with either glass microspheres, aluminum oxide or beta-eucryptite and catalyzed with either an aliphatic amine, a liquid aromatic amine eutectic blend, or a liquid anhydride are discussed. The properties of a CTBN modified epoxy are also included. Twelve formulation-cure cycle combinations were chosen for evaluation. The temperature dependent properties from -65/sup 0/ to 400/sup 0/F (-54/sup 0/ to 204/sup 0/C) for the 12 combinations are given.
Research Organization:
Bendix Corp., Kansas City, MO (USA)
DOE Contract Number:
EY-76-C-04-0613
OSTI ID:
7218817
Report Number(s):
BDX-613-1519(Rev.1)
Country of Publication:
United States
Language:
English